Grand Venture Technology (GVT) has been selected to supply parts and components for so-called next generation thermal compression bonding (TCB) equipment to a “leading global semiconductor assembly and packaging equipment manufacturer”.
GVT says that the win was enabled by its early engineering engagement and strong collaborative relationship with the customer, which was not named.
GVT expects new opportunities and revenue growth momentum to begin from 2025 onwards.
The customer’s equipment is said by GVT to play a key role in advanced semiconductor packaging of next generation chips, which are to be used in data centres, graphic cards, artificial intelligence (AI) accelerators, mobile application processors and high bandwidth memory (HBM).
GVT, citing tech strategic development firm, Yole Intelligence, says that this advanced packaging market is to grow at a compound annual growth rate (CAGR) of 11% between 2023 and 2029 and will reach US$69.5 billion ($94.6 billion) in 2029.
Additionally, the 2.5D and 3D advanced packaging sector is also projected to maintain a robust CAGR from 2023 to 2029 of 18% to reach US$27.6 billion in 2029.
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GVT’s executive deputy chairman Ricky Lee says the company is proud to be chosen as the preferred supplier for this critical packaging technology project.
“Our track record and expertise in precision engineering, combined with strong manufacturing capabilities, allows us to meet the highest standards of quality, accuracy and reliability that is demanded by our blue-chip customers in the semiconductor industry,” he says.
“We will continue to leverage on our advanced engineering competencies and unwavering commitment to quality to deliver top-in-class solutions,” adds Lee.
As at 11.11 am, shares in Grand Venture Tech are trading at 5.5 cents higher or 8.27% up at 72 cents.
